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Broadcom Unveils Sian Dsp for Efficient Hyperscale Data Centers

Published 10/02/2023, 10:14 PM
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Broadcom Inc. (NASDAQ: NASDAQ:AVGO) announced on Monday the availability of its latest 5nm 200G/lane optical PAM-4 DSP PHY, the Sian™ BCM85822, at the 49th European Conference on Optical Communication (ECOC 2023). The new product offers unprecedented bandwidth and efficiency to hyperscale data centers supporting AI workloads at scale.

The BCM85822 features 200G/lane serial optical interfaces which enable optical transceiver manufacturers to deliver cost-effective 800G and 1.6T pluggable modules. These modules meet the growing bandwidth needs and low power consumption requirements of hyperscale data centers.

The product is designed with an integrated laser driver and delivers best-in-class module performance in bit error rate (BER) and power consumption. It has proven interoperability with Broadcom’s 200G EML and complies with all IEEE and OIF standards. The BCM85822 supports MR links on the chip-to-module electrical interface and optical modules ranging from 800G to 1.6T.

Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom, highlighted the significance of this launch. He stated that this latest generation of DSP operating at 200G/lane extends Broadcom's leadership in high-bandwidth PHY and enables the lowest power optical modules in the industry.

Broadcom's consistent increase in earnings per share and high return on invested capital, as noted by InvestingPro Tips, reflects its commitment to innovation and operational efficiency. The company has been a prominent player in the Semiconductors and Semiconductor Equipment industry, with a track record of 13 consecutive years of raising dividends. This operational success is reflected in its market cap of 344.43B USD and a P/E ratio of 24.76, according to InvestingPro data.

With increasing bandwidth demands from AI-driven workloads in hyperscale data centers, deploying 1.6T OSFP-XD transceiver modules could double the bandwidth capacity per rack unit without changing the existing infrastructure. The BCM85822 is optimized for this module design, enabling a switching capacity of up to 51.2T in a single rack unit to improve bandwidth density.

Broadcom demonstrated its BCM85822 and 200G EML operating inside Eoptolink 1.6T DR8, 1.6T 2xFR4, and 800G DR4 optical modules at the ECOC 2023 exhibition in Glasgow, Scotland. Attendees saw a live traffic stream of data running between optical modules connected to a Tomahawk 5 switch in an end-to-end link.

The company is currently sampling both the BCM85821 and BCM85822 to its early-access customers and partners. The BCM85821 is an 800G (8:4) PAM-4 DSP PHY with no integrated laser driver.

Broadcom's commitment to innovation and financial strength is further evidenced by its high earnings quality, with free cash flow exceeding net income, and its ability to maintain dividend payments for 14 consecutive years. These factors, along with the company's high return on assets, have contributed to a strong return over the last five years, as highlighted by InvestingPro Tips. The company's fair value, as estimated by InvestingPro, stands at 794.88 USD, reflecting its solid financial performance and promising future prospects.

This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.

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